Boardoza MLX90641 16x12 Thermal Imaging Breakout Board
Boardoza MLX90641 is a specialized thermal imaging breakout board built wih the Melexis MLX90641 far-infrared sensor array. It features a resolution of 16x12 pixels, delivering 192 individual thermal data points for precise non-contact temperature measurement. The device covers a substantial object temperature range from -40 °C to +300 °C. Optically, the sensor provides a Field of View (FoV) of 55° on the X-axis and 35° on the Y-axis. For connectivity, the board utilizes a digital I2C interface supporting logic levels of 3.3V and 5V. This module is ideally suited for industrial monitoring, thermal analysis, and advanced embedded sensing applications.
Key Features
- 16x12 Pixel Thermal Resolution (192 pixels)
- -40 °C to +300 °C Measurement Range
- 55° X Axis 35° Y Axis Field of View (FoV)
- Digital I2C Interface Output
- 3.3V/5V Compatibility
Technical Specifications
- Supply Voltage (VCC)
- 3.3V to 5.5V DC
- Logic Voltage Level
- 3.3V , 5V DC
- Typical Current Consumption
- \~ 15mA
- Communication Interface
- I2C
- Sensor Refresh Rate
- 0.5Hz to 64Hz
- I2C clock frequency
- Up to 1 MHz
- Sensor Measurement Range
- -40°C to +300°C
- Operating Temperature
- -40°C /+85°C
- Board Dimensions
- 20x20mm
Support
For technical questions, documentation and issue reports, use the GitHub repository or write to us directly.